Gate News message, April 22 — ASMPT Ltd, a Singapore-based semiconductor assembly and packaging equipment maker, raised its second-quarter revenue guidance to $540 million–$600 million, exceeding Bloomberg consensus of $531.1 million, citing strong AI-linked semiconductor demand.
First-quarter revenue reached $507.9 million, beating estimates, with profit from continuing operations at HK$326.4 million ($41.6 million) following the divestiture of its NEXX segment. First-quarter bookings hit $727 million, the company’s highest in four years, with expectations for bookings to remain elevated in Q2.
Growth is driven by specific product lines: Thermo-Compression Bonding (TCB) tools for advanced logic chips and next-generation High Bandwidth Memory (HBM4) modules face strong demand, while photonics products for optical data transmission posted a five-fold year-over-year revenue increase from bulk orders for 1.6-terabit transceiver solutions used in data center networking. Traditional wire bonding and die bonding tools also gained ground from AI infrastructure expansion in China, and the Surface Mount Technology (SMT) segment reached record bookings on strong AI server demand.
ASMPT noted it has not experienced material impact from the Iran conflict, though uncertainty persists. The company is evaluating strategic options for its SMT Solutions Segment, including divestiture, joint venture, spin-off, or continued internal development, to focus resources on its higher-growth Semiconductor Solutions Segment.
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