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The Ridiculously Nerdy Intel Bet That Could Rake in Billions
Intel is making a significant bet on advanced chip packaging, a process that combines multiple small chiplets onto a single custom chip, with the potential to generate billions in revenue. This strategy positions Intel against market leader TSMC and aims to capitalize on the increasing demand for custom AI chips. The company has invested heavily in facilities like its Rio Rancho plant and is reportedly in talks with major tech companies like Google and Amazon for its packaging services, with CEO Lip-Bu Tan and CFO Dave Zinsner highlighting its importance for future growth.